Description
- Isolated round pads around each hole (8015-1)
- Plated-thru holes
- 0.080″ diameter, isolated solder pad around each hole, both sides
- Unrestricted component placement, extended area for high density applications
- Circuit Pattern: Pad-Per-Hole
- Contacts: N/A
- Width/Thick: 4.00″ / .062″
- Height: 6.00″
- 16-Pin DIP Capacity: 72
- Material: FR4
FOR USE WITH:
- Wire Wrap Terminals: T44, T46, T49, T68
- Solder Terminals: T42-1, K24C
- Wire-Wrap Socket Pins: R32
- Hole Diameter: .042″
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