Description
- 0.1″ spacing SIP design Direct fit with .1″ breadboards, sockets and connectors.
- Modular design enhances packaging density Create and use combinations of modules in testing and design.
0.1" spacing SIP design Direct fit with .1" breadboards, sockets and connectors.Modular design enhances packaging density Create and use combinations of modules in testing and design.
Reviews
There are no reviews yet.