Description
- Circuit pattern etched onto wiring side only
- Solder mount DIP sockets or IC devices with any lead spacing
- 3-hole solder pads (0.28″ x 0.080″) for interconnecting multiple component leads
- Circuit Pattern: 3-Hole Solder Pad
- Contacts: N/A
- Width/Thick: 6.5
- Height: 4.50″
- 16-Pin DIP Capacity: 20
- Material: CEM-1
FOR USE WITH:
- Wire-Wrap Terminals: T44, T46, T49, T68
- Solder Terminals: T42-1, K24C, K31C
- Wire-Wrap Socket Pins: R32
- Hole Diameter: 0.042″
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